Tshiab Constantan Flat Hlau Copper Nickel Alloy 6j11 Ribbon 0.4 * 2mm
Yam ntxwv | Resistivity (200C μΩ m) | Max. Ua haujlwm kub (0C) | Tensile zog (Mpa) | Melting point (0C) | Qhov ceev (g / cm3) | TCR x10-6 / 0C (20 ~ 600 0C) | EMF vs Cu (μ V / 0C) (0 ~ 100 0C) |
Alloy Nomenclature | |||||||
NC003 (CuNi1) | 0.1 | 200 | ≥ 250 | 1095 ib | 8.9 ib | <100 | -12 |
Lub cev muaj zog | Metric | Cov lus pom |
Qhov ntom | 8.94 g/m² | |
Mechanical Properties | Metric | Cov lus pom |
Tensile Strength, Qhov kawg | 262-531 MPa | |
Tensile zog, tawm los | 276-524 MPa | Nyob ntawm npau taws |
Elongation ntawm Break | 46.0% | ua 50,8mm. |
Modulus ntawm Elasticity | 115 GPa | |
Poissons Ratio | 0.310 ib | Muab xam |
Machineability | 20% | UNS C36000 (dawb-txiav tooj dag) = 100% |
Shear Modulus | 44.0 GPA | |
Cov khoom hluav taws xob | Metric | Cov lus pom |
Hluav taws xob Resistivity | 0.0000120 hli-cm @Tsov kub 20.0°C | |
Thermal Properties | Metric | Cov lus pom |
CTE, linear | 17.5 µm / m-° C 20.0 - 300 ° C | |
Tshwj xeeb kub muaj peev xwm | 0.380 J / g-° C | |
Thermal conductivity | 64.0 W/mK @Tsov kub 20.0°C | |
Melting Point | < = 1125 ° C | Liquidus |
Liquidus | 1125 ° C | |
Cov khoom ua haujlwm | Metric | Cov lus pom |
Annealing kub | 565-815 ° C | |
Kub-ua haujlwm kub | 815-950 ° C | |
Component Elements Properties | Metric | Cov lus pom |
tooj, Cu | > = 91.2% | |
Hlau, Fe | 1.30 - 1.70% | |
Lead, Pb | <= 0.050% | |
Manganese, Mn | 0.30 - 0.80% | |
Nickel, Nia | 4.80 - 6.20% | |
Zinc, Zn | <= 1.0% |
CuNi44 Cov ntsiab lus tshuaj,%
Ni | Mn | Fe | Si | Cu | Lwm yam | ROHS Cov Lus Qhia | |||
Cd | Pb | Hg | Cr | ||||||
44 | 1% | 0.5 | - | Bal | - | ND | ND | ND | ND |
Mechanical Properties
Max Continuous Service Temp | 400ºC |
Resisivity ntawm 20ºC | 0.49 ± 5% ohm mm2 / m |
Qhov ntom | 8,9g 3 |
Thermal conductivity | -6 (Max) |
Melting Point | 1280ºC |
Tensile zog, N / mm2 Annealed, Mos | 340 ~ 535 Mpa |
Tensile Strength, N / mm3 Txias Rolled | 680 ~ 1070 Mpa |
Elongation (ntxiv) | 25% (Min) |
Elongation (txias dov) | ≥2% (Min) |
EMF vs Cu, μV / ºC (0 ~ 100ºC) | -43 |
Micrographic Structure | austenite |
Magnetic Property | Tsis yog |