CuMn7Sn Copper Manganese Tin Alloy Sawb Siv rau Chip Resistors
CHEMICAL COMPOSITION
| Mn% | Sn% | Cu% | |
| Nominal Composition | 7 | 2.5 | Bal. |
Lub cev muaj zog
| Qhov ceev g / cm3 | 8.5 |
| TCR 10-6 / K | ± 10 |
| Elastic Modulus GPa | 125 |
| Thermal conductivity W / (m·K) | 35 |
| Thermal expansion coefficient 10-6 / K | 21.6 ib |
| EMF μV / K | -1 |
| Resistivity Ohm mm2 / m | 0.29+/- 0.04 |
MECHANICAL PROPERTIES
| Xeev | Yield zog | Tensile zog | Elongation | Hardness |
| Mpa | MPa | % | HV | |
| R350 | - | 350 | 30 | 70 |
150 000 2421